[CMC Research] [New publication information] Latest industry report on materials and devices that support the world’s AI data centers Published by: CMC Research Co., Ltd.
*CMC Research*
Press release: September 17, 2024
**
[New publication information] Latest industry report on materials and devices that support the world’s AI data centers Published by: CMC Research Co., Ltd.
*★We have published a report that analyzes industry and market trends, focusing on materials and devices that are expanding for use in AI data centers that can handle rapidly increasing AI processing. * View details
CMC Research Co., Ltd. (Kanda Nishiki-cho, Chiyoda-ku, Tokyo, https://cmcre.com/ ) has recently announced the launch of “Materials and devices that support the world’s AI data centers.”
We would like to inform you that we have published a book entitled “Latest Industry Report” on September 13, 2024.
The list price of the book is 150,000 yen (165,000 yen including tax) (book), and the list price of the book and CD set is 200,000 yen (including tax).
220,000 yen) (book + CD), and is now available for purchase.
[New publication information] Latest industry report on materials and devices that support the world’s AI data centers
Materials and Devices to Support AI Data Center
■ Latest industry report on materials and devices that support the world’s AI data centers
■ Published: Published on September 13, 2024
■ List price: Base price 150,000 yen (165,000 yen including tax) Main unit + CD set 200,000 yen (220,000 yen including tax) ■ Format: A4 size, paperback, 273 pages
■ Edited and published by: CMC Research Co., Ltd.
ISBN 978-4-910581-58-3
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[Features of this book]
・The data center cooling market in 2030 will expand by ●% compared to 2023 to ● billion yen! Investigate the background!
・Research the technology trends of silicon photonics and the background behind the adoption of PIC!
・We explored the market forecast for Si, SiC, GaN, and Ga2O3 semiconductors, their background, and the development of each application!
・Why do NVIDIA and AMD adopt CoWoS technology? What are the
challenges? What is TSMC’s strategy?
・Advantages and disadvantages of interposers, industry trends, and trends of TSMC, Intel, and Samsung!
・What are the business opportunities for Japanese companies as the competition for global HBM market share intensifies?
・We explored the performance and technology trends required for underfill, market forecasts, and shares by company!
・What is the market for FC-BGA boards for AI servers/data centers, shares by company, and corporate strategies?
・The market for high multilayer boards for AI servers in 2024 is predicted to expand by ●% from the previous year to ● billion yen! ・Market forecast for low dielectric resin MPI, LCP, fluororesin, thermosetting PPE, etc. for high frequency use!
◎Introduction
Since the appearance of “ChatGPT”, generative AI has been attracting attention. The key to this performance is the AI data center. In data centers that house thousands of servers equipped with AI semiconductors, demand related to “thermal management,” “optical communications,” and “energy saving” is increasing, and business opportunities exist for companies that supply devices and materials related to these. is expanding.
In terms of “thermal management,” there is an urgent need to take measures to deal with the heat generated by GPU servers and other devices. Semiconductors are heat generating bodies, and if the heat is not controlled, thermal runaway will occur. With the increase in the number of AI servers, thermal management is becoming increasingly important from the perspective of power saving. A system for removing heat from data centers is essential, including dissipating server heat through air or water cooling.
Optical communications are contributing to connections between high-performance servers in data centers that continue to be built around the world. The introduction of equipment and facilities suitable for large-capacity data transmission, such as optical fiber cables, is progressing. AI data centers require significantly more fiber optic cables than traditional data centers.
In recent years, silicon photonics, a technology that integrates elements such as optical waveguides, optical switches, optical modulators, and photodetectors on silicon substrates, has attracted attention. It is compatible with existing silicon manufacturing technology, allowing electronic and optical devices to be integrated on the same chip. Therefore, it increases data center bandwidth and significantly reduces power consumption. Also, Co-Packaged
Optics (CPO) is expected to improve data transfer speeds in data centers by incorporating optical components and semiconductor chips into the same package and using light to transmit and receive data.
Next-generation power semiconductor materials such as SiC and GaN are attracting attention because they contribute to energy savings. For data centers, the introduction of SiC power semiconductors is progressing rapidly. Adopting SiC power semiconductors in
uninterruptible power supplies (UPS) used in data centers will significantly reduce power loss. On the other hand, GaN power semiconductors have advantages over SiC in compact, high-frequency applications such as switching power supplies. By adopting this in a UPS for data centers, the switching speed can be increased and the system can be made more compact, leading to space savings within the data center.
As AI evolves at an accelerating pace, there is a need to build AI data centers that can handle the rapidly increasing amount of AI processing. This report focuses on materials and devices that are expanding for AI data center applications, and analyzes industry and market trends. This report is designed to lead to next-generation business with an eye on future developments.
CMC Research Investigation Department
[Summary of the structure and table of contents of this book] Part I AI Data Center
Part II Cooling/heat measures
Part III Optical communication related
Part IV Next generation semiconductors
Part V Packaging technology
Part VI High multilayer substrate/low dielectric resin
☆Click here for the detailed table of contents of this book!
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◎Information on books related to CMC Research publications and scheduled webinars
☆Click here for a detailed list of books and to purchase! ↓
https://cmcre.com/archives/category/cmc_all/
☆Click here for a list of upcoming webinars! ↓
https://cmcre.com/archives/category/seminar/semi_cmcr_f/