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ROHM Co., Ltd. Significantly improved insulation resistance with a uniquely designed package! Developed SiC Schottky barrier diode compatible with higher voltages in xEV systems

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[ROHM Co., Ltd.] Significantly improved insulation resistance with a uniquely designed package! Developed SiC Schottky barrier diode compatible with high voltage xEV systems ​
ROHM Co., Ltd. Press release: November 12, 2024 Significantly improved insulation resistance with our uniquely designed package! Developed SiC Schottky barrier diode compatible with higher voltages in xEV systems Secures approximately 1.3 times the creepage distance compared to general products. No need for insulation treatment with resin potting even for surface mount type
https://prcdn.freetls.fastly.net/release_image/62988/52/62988-52-021cd7d943279f554471d7cde0994a07-2126×1535.jpg

SiC SBD for automotive equipment “SCS2xxxNHR” ROHM Co., Ltd. (Headquarters: Kyoto City) has developed a surface-mount type SiC Schottky barrier diode (SBD) that has increased insulation resistance by increasing the creepage distance (*1) between terminals. SCS2xxxNHR We have a lineup of 8 models, and from December 2024, we plan to start selling 8 models of “SCS2xxxN” for industrial equipment such as FA equipment and PV inverters. The new product removes the center pin at the bottom of the conventional package and uses a ROHM original package with a unique shape, increasing the creepage distance to a minimum of 5.1 mm, approximately 1.3 times that of conventional products. By ensuring a long creepage distance, tracking (creeping discharge) (*2) between terminals can be suppressed, so insulation treatment using resin potting (*3) is not required when surface mounting devices on a board in high voltage applications. .
https://prcdn.freetls.fastly.net/release_image/62988/52/62988-52-75361770671209e9620ab82a2c563e0f-1122×1654.jpg TO-263-2L package of SCS2xxxN(HR) There are two types of voltage resistance: 650V and 1200V, and in addition to the 400V system widely used in xEVs (electric vehicles), it can also be used in higher voltage systems, which are expected to be increasingly adopted in the future. Additionally, it can be mounted on the same land pattern as general and conventional TO-263 packages, allowing it to be replaced with existing circuit boards. Furthermore, “SCS2xxxNHR” for automotive equipment complies with the automotive reliability standard
AEC-Q101*4.
https://prcdn.freetls.fastly.net/release_image/62988/52/62988-52-87b7761dd82bcbb2eed8e83d34e835aa-2303×1713.jpg SiC SBD package shape comparison Sample shipments of the new product will begin in September 2024 (sample price: 1,500 yen/piece, excluding tax). The production bases are ROHM Apollo Chikugo Factory (Fukuoka Prefecture) for front-end processing and ROHM Korea Corporation (South Korea) for back-end processing. Online sales have also started, and can be purchased from Chip One Stop (TM), Core Staff Online (TM), etc. ROHM will continue to develop high-voltage SBDs using SiC and contribute to energy savings and higher efficiency in automobiles and industrial equipment by providing optimal power devices that meet market needs. News release:
https://www.rohm.co.jp/news-detail?news-title=2024-11-12_news_sbd&defaultGroupId=false Background In recent years, power semiconductors are essential for OBCs and other devices installed in xEVs, which are becoming increasingly popular, and demand is increasing for SiC SBDs, which generate less heat, have high-speed switching performance, and high voltage resistance. In particular, the need for surface mount (SMD) packaged products that are small and can be mounted using a mounter is accelerating as they lead to improved application productivity. On the other hand, however, tracking tends to occur due to the application of high voltage, so devices with longer creepage distances are required. As a leading SiC company, ROHM has been working on the development of high-performance SiC SBDs that have both high voltage resistance that can support high-voltage applications and high mountability. Now, by adopting a unique shape for the package, we have secured a minimum creepage distance of 5.1 mm and developed this product with high insulation performance. Product lineup
https://prcdn.freetls.fastly.net/release_image/62988/52/62988-52-1737a65ca3467260ee511c7c8eabc971-3543×1276.jpg 8 models of “SCS2xxxNHR” for automotive equipment and 8 models of “SCS2xxxN” for industrial equipment Application example In-vehicle equipment • On-board charger (OBC) • DC-DC converter etc. Industrial equipment • AC servo for industrial robots • PV inverter • Power conditioner • Uninterruptible power supply (UPS) etc. Internet sales information Sales online trading company Chip One Stop (TM) ; CnSCS205KNHRTRL\r% 5Cn SCS210KNHRTRL\r\n SCS220KNHRTRL” style=”text-decoration:underline;color:#666;word-break:break-all;” target=”_blank” rel=”nofollow ugc noopener”> Core Staff Online (TM) It will be released sequentially from other online trading companies. Items for sale For automotive equipment “ SCS2xxxxNHR ” is on sale “SCS2xxxxN” for industrial equipment is scheduled to be sold sequentially from December 2024
https://prcdn.freetls.fastly.net/release_image/62988/52/62988-52-93b165e4e708a1fdcd2de675c51c3d8a-827×709.jpg Can be purchased from 1 piece About the “EcoSiC(TM)” brand EcoSiC(TM) is a brand of devices that use silicon carbide (SiC) material, which is attracting attention in the power device field for its performance superior to silicon (Si). ROHM independently develops technologies essential to the evolution of SiC, from wafer manufacturing to manufacturing processes, packaging, and quality control methods. Additionally, we have adopted an integrated production system for the manufacturing process, and have established ourselves as a leading company in the SiC field.
https://prcdn.freetls.fastly.net/release_image/62988/52/62988-52-1df0a62d7c0ef9697029f0820075ac24-612×400.png EcoSiC(TM) brand EcoSiC(TM) is a trademark or registered trademark of ROHM Co., Ltd. Terminology explanation *1) Creepage distance The shortest distance between two conductors (terminals) along the surface of a device package. In semiconductor design, it is necessary to take insulation measures by ensuring creepage distance and clearance distance to prevent electric shocks, leakage, and short circuits in semiconductor products. *2) Tracking (creeping discharge) A phenomenon in which discharge occurs across the surface of an insulating package when a high voltage is applied to a terminal, which is a conductor. Discharge occurs between patterns that should not be electrically conductive, causing dielectric breakdown of the device. This phenomenon is more likely to occur as the creepage distance becomes shorter due to the miniaturization of the package. *3) Resin potting Electrical insulation is achieved by sealing the device itself and the electrode connections between the device and the circuit using resin such as epoxy. It is also effective in protecting devices,
waterproofing and dustproofing, and improving durability and weather resistance. *4) Automotive reliability standard “AEC-Q101” AEC is an abbreviation for Automotive Electronics Council, which is a
reliability standard for in-vehicle electronic components that was established by major automobile manufacturers and major electronic component manufacturers in the United States. Q101 is a standard applied to discrete semiconductor components (transistors, diodes, etc.). Note) “Chip One Stop (TM)” and “Core Staff Online (TM)” are trademarks or registered trademarks of each company.

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