[CMC Research] [Livestream/ZOOM] Seminar held: “Applications of Silica Microparticles and Their Role and Use in Cutting-Edge Fields – Silica Microparticles Used in Everyday Products to Cutting-Edge Products” Tuesday, October 7th, Sponsored by: CMC Research, Inc.
CMC Research Press release: September 2, 2025 To Members of the Press [Livestream/ZOOM] Seminar to be held on “Applications of Silica Microparticles and Their Role and Use in Cutting-Edge Fields – Silica Microparticles Used in Everyday Products to Cutting-Edge Products”! Tuesday, October 7th, Sponsored by: CMC Research, Inc. ★Silica microparticles are used in a wide range of applications, from everyday products to semiconductors. We will provide a systematic explanation, incorporating insights from development sites, covering everything from applications and properties to their role in cutting-edge fields.
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Details ������ There will also be time for questions and answers. Please join us to put this knowledge to use in your research and work! 【Knowledge Gained from the Seminar】 ・ General knowledge of silica microparticles (uses, specifications: raw materials,
manufacturing methods, characteristics) ・Silica Microparticle Product Condition and Precautions ・The Role of Silica Microparticles in Cutting-Edge Fields (Optics, Semiconductors) 【Target Audience】 ・Those interested in silica and its applications (everyday use, industrial use, etc.) ・Those interested in the role of silica in cutting-edge fields (semiconductors, optics) ・Those interested in technical information on silica fillers for semiconductor encapsulation materials 1) Seminar theme and date and time Theme: Applications of Silica Microparticles and Their Role and Use in Cutting-Edge Fields – Silica Microparticles Used in Everyday Products to Cutting-Edge Products – Date and Time: Tuesday, October 7, 2025, 1:30 PM – 4:30 PM Participation Fee: 44,000 yen (tax included) * Materials included ＊ ¥39,600 (tax included) for newsletter subscribers ＊ Academic price: ¥26,400 (tax included) Instructor: Shigeru Koshibe Representative Director of I-Pac Co., Ltd. Silica microparticles are used for a variety of purposes (everyday, industrial, etc.). However,
opportunities to obtain accurate information about silica
microparticles are rare. This course provides a clear overview of a wide range of information about silica microparticles (applications, specifications: raw materials, manufacturing methods, etc.). It also focuses on the role of silica microparticles in cutting-edge fields (optics, semiconductors). In particular, it provides a detailed explanation of silica fillers used in semiconductor encapsulation materials. The instructor, who works as a frontline developer at a silica manufacturer and a materials manufacturer, will use his valuable experience to explain silica microparticles. *This seminar will be live-streamed using the video conferencing tool “Zoom” on the day of the event. Please refer to the tool for the recommended environment. The viewing URL will be emailed to you at a later date. ★Recording and filming during the course are strictly prohibited. 2) How to apply Please apply through the CMC Research seminar website. We will contact you separately by email with the viewing URL. See the URL for details. Apply here Learn more 3) Introduction to the seminar program (there will be a break) 1. Applications of silica fine particles 1) Daily products 2) Industrial products 3) Advanced products 2. Classification of silica particles 1) Raw materials 2) Type 3) Particle size 3. Manufacturing method of silica fine particles 1) Overview; Powder silica, suspension silica, manufacturing company 2) Manufacturing method: crystal, melting, melting, combustion, fumes, firing, refining 4. Characteristics and Test Methods of Silica Microparticles 1) General Characteristics 2) Test Methods 3) Powder Characteristics 5. Surface treatment of silica microparticles 1) Purpose 2) Surface condition 3) Functionalization 4) Processing method 5) Evaluation method 6. Dispersion technology of silica particles 1) Agglomeration 2) Dispersion and crushing 3) Distribution method 4) Dispersibility evaluation method 7. Roles and Applications of Silica Microparticles in Cutting-Edge Fields 1) Optical Field: Refractive Index Adjustment, Scattering and Reflection 2) Semiconductor Field: ACF Insulation Materials, Wafer Processing Materials (Polishing, etc.), and Fillers for Encapsulating Materials [Q&A] 4) Instructor introduction Mr. Shigeru Koshibe Representative Director, I-Pac Co., Ltd. [Lecturer career] 1974 Graduated from Osaka University Faculty of Engineering 1976: Completed Master’s Program at the Graduate School of Engineering, University of Tsukuba 1976: Joined Sumitomo Bakelite Co., Ltd., where he worked on the development of semiconductor encapsulation materials, etc. 1988: Joined Tonen Chemical Co., Ltd., where he worked on the development of silica and silicone gels, etc. 2001: Established iPac, Inc., providing technical consulting for the development of materials in the semiconductor and optical fields. [History] Industrial property rights applications: > 200, books written: > 60, seminars: > 200 Book Writing List (Writing Activities June 2025) Books Related to Semiconductor Encapsulation 1) Nikkei Microdevices, May 11, 1984, pp. 82-92 – Epoxy encapsulants for VLSIs are becoming increasingly low-stress. 2) Nikkei Microdevices, November 2002, pp. 70-71 – To prevent recurrence, it is urgent to investigate the cause and review evaluation methods (Fujitsu HDD problem). 3) Electronic Materials, August 2004 issue, pp. 44-46 & Electronic Technology, January 2005 issue, pp. 90-93 ・Trends in Semiconductor Packaging 4) Complete Collection of Encapsulation Technology and Material Development for the Latest Semiconductors and LEDs, P296-304 (Technical Information Association, November 2006) – Mechanisms of Defects in Semiconductor Encapsulating Resin Materials and Their Countermeasures 5) Epoxy Resin Formulation Design and Functional Improvement, P166-174,190-107 (Science & Technology, August 2008) – High-performance epoxy resins used in rigid printed circuit boards – High-performance epoxy resins used in semiconductor encapsulation materials 6) Design and Use of Antistatic Materials, P227-233 (Science & Technology, December 2008) ・Antistatic Technology for Encapsulating Materials 7) Electronic materials July 2009 issue, P86-90 ・Latest trends in thin film materials for next-generation packaging 8) Latest technology of heat-resistant polymer materials for high-performance devices, P65-73 (CMC Publishing, April 2011) -Technological Trends in High-Heat Resistance and High-Heat
Dissipation Materials for Power Devices in Automotive, Light-Current, and Electronic Components Books Related to Semiconductor Encapsulation (2) 9) Material Stage, November 2011, pp. 32-34 – Current situation surrounding encapsulation technology and encapsulation materials 10) New technologies for lighter, thinner, shorter, and smaller products in new product development, pp. 404-408 (Technical Information Association, October 2012) – Required performance of semiconductor encapsulation materials for lighter, thinner, shorter, and smaller products 11) Encapsulation and Sealing in the Advanced Electronics Field Materials Design and Process Technology, pp. 473-478 (Technical Information Association, August 2013) Issues – Required Properties and Evaluation Methods for Recent Semiconductor Encapsulation Materials 12) Mechanism of Air Bubbles and Voids Formation and
Preventive/Removal Measures, P388-393 (Technical Information Association, February 2014) ・Causes of Bubble Formation in
Encapsulating Materials and Countermeasures 13) Functional Materials, January 2015 Issue, P3-4, P11-18 – Heat management technology for polymer materials for next-generation power devices – Latest technological trends in encapsulating materials for power devices 14) Property Improvement and High-Performance Composite Technology of Epoxy Resins for Electronics, pp. 249-253 (Technical Information Association, February 2015) ・How to Use and Select Hardeners Effectively in Epoxy Resin Molding 15) Elucidating the Causes of Residual Stress in Polymer Materials and Measures to Reduce It, pp. 177-184 (Technical Information Association, February 2017) ・Internal Stress Generation Mechanisms in Molding Materials and Countermeasures 16) Development Trends in Next-Generation Semiconductor Packaging and Necessary Packaging and Material Technologies (Science & Technology, July 2017) Books Related to Semiconductor Encapsulation (3) 17) Thermal Management Technologies Required for Future EVs and HEVs, pp. 81-94 (Information Organization, August 2018) – Heat dissipation measures for encapsulating materials for power devices and development of next-generation packaging technology 18) High-performance epoxy resins and their effective use, pp. 81-88 (R&D Support Center, November 2018) – Selection and use of epoxy resin hardeners 19) Development of High Thermal Conductivity Resins, pp. 356-366 (Technical Information Association, July 2019) – Characteristics and High Heat Dissipation of Encapsulating Materials for Power Devices 20) Design and Development Guidelines for Components, Materials, and Devices for 5G, pp. 15-36 (Information Organization, September 2019) – Overview of High-Speed Wireless Communications for the 5G Era and Considerations for Increasing Semiconductor Speed 21) Semiconductor Encapsulation Materials Overview (Science & Technology, November 2019) 22) Research and Development Leader, May 2020 issue, pp. 14-26 ・5G Changes in Semiconductor Packaging Materials and Technologies 23) High-Speed Systems and Components for 5G and Beyond 5G ・Proper Use and Selection of Hardeners in Epoxy Resin Molding 3) Industrial Materials, October 1995, pp. 45-47 (CMC Research, June 2020) 24) Collection of Materials for Encapsulation/Barrier/Protection/Sealing Technologies and Materials, pp. 3-11, 329-335 (Technical Information Association, April 2021) – Overview of Encapsulation, Barrier, and Sealing Technologies ・Overview of the required characteristics and evaluation methods of recent semiconductor encapsulation materials Books related to semiconductor encapsulation (4) 25) How to select and use polymerization initiators, curing agents, and crosslinking agents, and examples, pp. 592-600 (Technical Information Association, May 2021) ・Design and use of printed circuit boards and encapsulating materials for electronics 26) Development Trends and Application Expansion of Next-Generation Power Semiconductors, pp. 269-282 (CMC Publishing, August 2021) ・Packaging Technology and Challenges for Power Devices for High-Speed Communication Equipment 27) Development Trends in Semiconductor Packaging and Materials Technology Entering a Period of Reform (Science & Technology, January 2022) 28)
Encapsulation and Barrier Technology for Advanced Devices, pp. 97-110, 111-125 (CMC Publishing, December 2022) ・Latest Trends in
Semiconductor Packaging Technology・Trends in Power Device
Encapsulation Technology 29) Automotive Technology, April 2023 Issue, P1-8 (Vol. 10, No. 7, 2023)・Latest Trends in Advanced Semiconductor Packaging and Future Demand for Encapsulation Technology 30) Epoxy Resin Formulation Design and High Performance, P255-264 (Technical Information Association, October 2023) ・Characteristics of Epoxy Resin Materials for Semiconductor Encapsulation and Trends in Advanced Semiconductor Packaging 31) Packaging Materials, Technologies, and Thermal Management for Next-Generation Power Devices, P241-253 (Technical Information Association, August 2024) – Required
Characteristics and Challenges of Encapsulating Materials for Power Devices on New Substrates, Such as SiC 32) Research and Development Leader, August 2025 Issue, P- ・Trends in cutting-edge semiconductor packaging technology in Japan and overseas and the activities of major players Books related to silicon chemicals 1) Chemistry and Industry, 1995, 48(6) P696-698 ・21st century untried material “αGEL” 2) Electronic Materials September 1995 issue, P127-130 ・Stress reliever for semiconductors 3) Industrial Materials, October 1995 issue, pp. 45-4 ・New Developments in the Multifunctional Material αGEL 4) Gel Handbook, pp. 180-187 (NTS, November 1997) ・Viscoelasticity of vibration-absorbing gels and their evaluation methods 5) Electronic Materials, July 2002 issue, pp. 72-74 ・Functional silica for CSP adhesive materials 6) Electronic Materials, May 2003 Special Edition, pp. 90-90 – Ultra-high-purity fumed silica for wafer-level packaging 7) Encyclopedia of Encapsulation Technology and Material Development for the Latest Semiconductors and LEDs, pp. 198-206 (Technical Information Association, November 2006) – Filler Overview and Usage History 8) Design and Manufacturing Technology of Transparent Resins for Various Optical Materials, P484-488 (Information Organization, December 2007) – Connecting Components and Materials (Optics) Reference) Books Related to Silicon Chemicals (2) 9) High-Performance Films and Resins Used in Solar Cells and Their Applications, pp. 264-269 (Technical Information Association, March 2010) ・Properties of Silicone Resins and Their Applications to Solar Cell Components 10) Countermeasures against deterioration and discoloration of transparent resin and their evaluation, P20-24, 126-129 (Technical Information Association, March 2012) ・Improvement of heat resistance of silicone resin and silica modification/silicone modification 11) Adding functionality to film and coating agents without impairing
transparency, P60-63 (Technical Information Association, November 2012) ・High heat resistance and high transparency due to the characteristics of silica and silica hybrid 12) Adding
multifunctionality to transparent resins and films and application technology, P96-101 (Technical Information Association, November 2014) ・High heat resistance and high transparency of transparent resin using nano-silica hybrid Books related to optical materials 1) Electronic materials July 2003 issue, P18-21 ・Essential technology for
verification and practical application of plastic optical fiber 2) Electronic materials February 2004 issue, P82-85 & Electronic technology July 2004 issue, P96-99 ・Current status of plastic optical fiber applications 3) Electronic materials September 2005 issue, P81-85 & Electronic technology April 2006 issue, P102-106 ・Overview of transparent materials for LED/OLED 4) Analysis, control and
troubleshooting of thermal stress in electronic materials and packaging technology, P345-353 (Technical Information Association, January 2006) ・LED sealing resin material 5) Electronic Materials September 2006 issue, P31-34 & Electronic Technology May 2007 issue, P84-87 ・LED packaging technology 6) Electronic Materials May 2007 issue special edition, P65-68 ・Organic EL sealing material 7) Design and manufacturing technology of transparent resin for various optical materials, P121-125, 126-129, 154-158, 189-195 (Information
Corporation, 2007.12) ・Thermosetting epoxy resin ・UV curable epoxy resin ・Current status and problems with epoxy-based encapsulating resin and resin encapsulating materials for LEDs 8) Electronic Materials April 2009 issue, P71-73 & Electronic Technology March 2010 issue, P95-98 ・Composite material for high heat generation LEDs Reference) Books related to optical materials (2) 9) High-performance device sealing materials and cutting-edge materials, P114-125 (CMC Publishing, August 2009) ・LED sealed 10) Monthly Display February 2010 issue, P65-70 ・Current status and future of LED encapsulating materials 11) High functionality of films and resins used in solar cells and their applications, P164-169 (Technical Information Association, March 2010) ・Technology and prevention of deterioration of polymer materials due to oxidative deterioration 12)
High-efficiency process and material technology for LED lighting, P303-312 (Science & Technology, May 2010) ・Composite material for high heat generation LED 13) Adding functionality to film/coating agents without impairing transparency ・High dispersion technology during nanofiller compound production ・Sealing technology and required materials for light receiving elements (solar cells, photodiodes) ・Sealing technology and required materials for light emitting devices (LEDs) 14) “Light” control technology and its application examples, P513-517 (Technical Information Association, March 2014) ・Wavelength conversion material and its manufacturing method 15) Functional Materials August 2014 issue, P23-30 ・Use of encapsulants and films to improve light extraction efficiency of OLED lighting 16) Epoxy resin for electronic components – cutting-edge technology of semiconductor packaging materials, P193-205 (CMC Publishing, March 2015) ・LED encapsulant materials and films Reference) Books related to optical materials (3) 17) Development of the latest organic EL display from the component parts, P13-23 (CMC Publishing, February 2017)
・Development of sealing material for OLED display devices 18) Micro LED manufacturing technology and challenges and development trends for mass production (Science & Technology, June 2018) 19) Development trends in materials and process technologies for next-generation display applications, P437-462 (Technical Information Association, February 2020) ・Micro LED display manufacturing technology,
development status and challenges for mass production 20) Optical semiconductors and their packaging and sealing technology (Science & Technology, 2023.2) View details 5) Information about upcoming webinars (online distribution seminars) ○ How to start DX for engineers amid the rapid progress of generative AI Digital transformation and science Monday, September 8th, 2025, 10:30-16:30 https://cmcre.com/archives/135437/ ○Fundamentals and
testing/evaluation techniques for chiplet implementation Tuesday, September 9, 2025 13:30-16:30 https://cmcre.com/archives/133007/ ○Bioethanol production technology and issues using biomass as raw material September 10, 2025 (Wednesday) 13:30-16:30
https://cmcre.com/archives/133880/ *Includes missed broadcasts ○Computational science simulation technology that forms the core of materials informatics September 12, 2025 (Friday) 10:30-16:30 https://cmcre.com/archives/134186/ ○The forefront of organic device science based on CT interaction ~ Application development from molecular design to OLEDs, organic lasers, and thermoelectric elements ~ Friday, September 12th, 2025, 13:30-16:30
https://cmcre.com/archives/135036/ *Includes missed delivery ○Plastic recycling in the zero carbon era September 16, 2025 (Tuesday) 13:30-16:30 https://cmcre.com/archives/135304/ *Includes missed broadcasts ○ Introduction to AI drug discovery in 2 hours September 17, 2025 (Wednesday) 10:00-12:00 https://cmcre.com/archives/131990/ ○Basics, applications, and development trends of Microphysiological Systems (MPS) September 18, 2025 (Thursday) 13:30-16:30
https://cmcre.com/archives/132889/ ○Basics, technology trends, and prospects of optical wireless power transfer technology Friday, September 19th, 2025, 10:30-16:30 https://cmcre.com/archives/130998/ ○ Heat dissipation/cooling technology for AI data centers September 24, 2025 (Wednesday) 10:30-16:30 https://cmcre.com/archives/134967/ ○Technology and development trends for FPD glass and semiconductor package glass, as well as glass processing, strength and strengthening methods September 25, 2025 (Thursday) 13:30-16:30
https://cmcre.com/archives/135357/ ○Crystal defect evaluation technology and trends for next-generation power semiconductors and power devices Monday, September 29th, 2025, 13:30-16:30
https://cmcre.com/archives/135061/ *Includes missed delivery ○Basics and mechanisms of corrosion of metal materials, and points of corrosion countermeasures and anticorrosion technology October 1, 2025 (Wednesday) 10:30-16:30 https://cmcre.com/archives/135908/ *Includes missed broadcasts ☆Click here for a list of upcoming webinars! ↓ https://cmcre.com/archives/category/cmc_all/ CMC Research Co., Ltd. (Kanda Nishiki-cho, Chiyoda-ku: https://cmcre.com/ ) conducts seminars and publishes books on market trends and technology trends for various materials and chemicals. 6) Information on related books ☆Click here for the list of published books↓
https://cmcre.com/archives/category/cmc_all/ All that