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Home » Explore » Links Co., Ltd. Links Co., Ltd. will exhibit at “International Imaging Equipment Exhibition 2023”, the l argest and most cutting-edge machine vision exhibition in Japan.

Links Co., Ltd. Links Co., Ltd. will exhibit at “International Imaging Equipment Exhibition 2023”, the l argest and most cutting-edge machine vision exhibition in Japan.

Links Co., Ltd.
Links Co., Ltd. exhibits at “International Imaging Equipment Exhibition 2023”, the largest and most cutting-edge machine vision exhibition in Japan
~ Set up the largest booth in the venue and experience Lynx’s technological capabilities through actual machines and demonstrations ~
……
Links Co., Ltd. (located in Shinagawa-ku, Tokyo; CEO: Kei Murakami; hereinafter referred to as Links), a technology provider that discovers cutting-edge technologies from around the world and implements them at manufacturing sites with its technical capabilities and experience, announced on December 6 We will be exhibiting at the “International Imaging Equipment Exhibition 2023″ (sponsored by Adcom Media Co., Ltd.), which will be held at Pacifico Yokohama for three days from Sunday (Wednesday).
The International Imaging Equipment Exhibition 2023, which will be held for the 45th time, is the largest and most cutting-edge machine vision exhibition in Japan.
Until now, as the “Japan’s largest and most cutting-edge machine vision exhibition”, we have exhibited many products and the latest products from fields such as machine vision/robot vision, AI/deep learning, medical, security, 3D, ITS, infrastructure maintenance, etc. This is an exhibition where exhibitors with technology gather together.
The outline of Lynx’s exhibition at “International Imaging Equipment Exhibition 2023 ITE” is as follows.
Name: International Imaging Equipment Exhibition 2023
Website: https://www.adcom-media.co.jp/ite/


Date and time: Wednesday, December 6, 2023 – Friday, December 8, 2023 Location: Pacifico Yokohama
Booth location: “1” D-Hall
■MVTec “Image processing library HALCON”
We will be introducing new feature demos of the latest version of Progress Edition 23.11, released on November 14th, at our booth. We will be exhibiting a demonstration of the appearance inspection of metal parts using the new Deep Learning feature “Multi-label image classification” and a full-scale appearance inspection demonstration using the new rule-based function “3D shape restoration using stripe projection.”
■MVTec “All-in-one image processing tool MERLIC”
Introducing MERLIC, an all-in-one image processing tool that allows you to build image processing applications with mouse operations. MERLIC not only allows you to build image processing, but also allows you to easily set up communication with external devices such as PLCs, so we will be exhibiting a demonstration of how it works with PLCs to switch recipes and output image processing results to PATLITE. We will also exhibit a demo machine that allows you to actually experience building MERLIC image processing so that you can check the flow of building image processing with MERLIC.
■MVTec “Deep Learning Tool, a GUI tool for learning deep learning models” We are preparing an exhibition corner that provides an
easy-to-understand overview of the overall flow of building deep learning image processing applications. We are exhibiting an introductory video of the Deep Learning Tool and a software operation experience booth, as well as application construction examples such as a battery visual inspection demo that combines deep learning and rule base, and a board visual inspection demo that uses deep learning non-defective product learning.
■iRAYPLE camera
We are exhibiting the iRAYPLE camera, which achieves low costs and short delivery times with overwhelming economies of scale.
You can see demonstrations using the latest models, such as the GigE/USB3.0 model equipped with SONY’s 4th generation sensor and the CoaXPress model equipped with Gpixel sensor, which has extremely high cost performance.
■Teledyne DALSA
We are exhibiting a wide lineup of line sensors from single line to TDI, resolution from 2k to 32k, mono/color, and proprietary sensor technology.
You can see demonstrations using the latest high-end line scan cameras, including wafer inspection using the industry’s highest resolution 32K TDI line scan camera and print inspection using contact image sensors.
■Teledyne FLIR
You can view industrial cameras that are compatible with various interfaces such as GigE/5GigE/10GigE and USB. You can see a multi-unit connection demo of the 5GigE camera Forge and the SDK “Spinnaker 4.0”, which is equipped with a unique driver technology that reduces the CPU load for image capture when multiple cameras are connected.
■Teledyne Photometrics
We are exhibiting Kinetix, the latest cooled science CMOS camera with ultra-high sensitivity and low noise, which is active in the biomedical/life science field. Compared to conventional sCMOS cameras, it is equipped with a sensor with more pixels, making it ideal for those using the latest wide-field microscopes.
■Basler
We will be exhibiting the main products of Basler, a leading company in industrial cameras. You can see a rolling shutter demonstration of Basler’s exclusive area sensor camera “ace 2″, a time-of-flight camera, and a wafer transmission inspection demonstration using the newly released SWIR camera.
■iRAYPLE Code Reader We are exhibiting the iRAYPLE Code Reader, which has a rich lineup, overwhelming cost, and powerful reading functions. View various use cases to improve logistics and production processes. ■LMI Technologies “Gocator2600” series
We will be exhibiting a demo of the latest model of the world’s highest resolution optical cutting profile sensor, the Gocator2600 series, “Gocator2618”.
With an X-resolution of 5μm while ensuring a field of view width of 20mm, it is possible to measure fine workpieces such as lead frames in 3D with high precision.
■heliotis “heliInspect H8/H8M”
We will be exhibiting “heliInspect,” a 3D sensor using white light interferometry that enables ultra-high precision 3D measurement at the nanometer level inline.
You can see a demonstration of how ultra-high precision 3D measurement can be applied to a wide field of view when combined with a linear motion stage.
■Chromasens “3DPIXA / Composite lighting”
We will be exhibiting 3DPIXA, a 3D line scan camera that is ideal for visual inspections that require speed and accuracy.
The combination of stereo scanning equipped with two RGB 3-panel color line cameras and 3-color lighting automates highly difficult visual inspections that were impossible with 2D photography.
■TRITON – Industrial Raspberry Pi reinvents PLC. By using “TRITON”, which has achieved high functionality at a low price, you can freely combine and select software according to the required functions using “CODESYS”, the world’s most used standard platform for control software. .
We will be exhibiting a demonstration of how TRITON realizes the functions required of recent equipment, such as IIoT, visualization, motion control, fieldbus compatibility, and OPC UA compatibility. ■Embedded system solution
Are you an equipment manufacturer looking for a new solution? As a manufacturer, Lynx provides one-stop support for embedded system development from concept planning to mass production, focusing on image technology and peripheral control systems, in order to meet customer demands that cannot be met with standard components. . Please feel free to contact Links.
At our booth, you can see an embedded vision system that simulates a specific project for a customer.
[Overview of Links Co., Ltd.]
Trade name: LINX Corporation
Representative: Kei Murakami, Representative Director and President Head Office: 5th floor, IK Building, 2-24-9 Kamiosaki, Shinagawa-ku, Tokyo 141-0021
TEL: 03-6417-3371 (Main) FAX: 03-6417-3372
Established: June 11, 1990
URL: https://corp.linx.jp/
-About Lynx-
Links Co., Ltd. is a technology provider that discovers cutting-edge technologies from around the world faster than anyone else, and uses its technical strength and experience to implement them at
manufacturing sites. Starting in August 2021, we will develop image processing/AI, robots/AMR, and IIoT (Industrial IoT) with the mission of “turning the dreams of the world’s geniuses into business” and the vision of “removing people from factories.” In fields such as SoC-based embedded system development, we accurately capture the timing of technological innovation from markets around the world and provide domestic customers with cutting-edge technologies, products, and services.
[Contact information] ■Links Co., Ltd. Public Relations Department TEL: 03-6417-3371 (Main) Mail: public_relations@linx.jp




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