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Home » Explore » Toray Engineering Co., Ltd. Launch of INSPECTRA(R) SR-IV, a semiconductor wafer visual inspection system that achieves the industry’s highest inspection speed for high-magnification, high-precision inspection

Toray Engineering Co., Ltd. Launch of INSPECTRA(R) SR-IV, a semiconductor wafer visual inspection system that achieves the industry’s highest inspection speed for high-magnification, high-precision inspection

Toray Engineering Co., Ltd.
Launch of INSPECTRA(R) SR-IV, a semiconductor wafer visual inspection system that achieves the industry’s highest inspection speed in high-magnification, high-precision inspection
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Toray Engineering Advanced Semiconductor MI Technology Co., Ltd. (Headquarters: Yokohama City, Kanagawa Prefecture, President: Kenji Sato, hereinafter referred to as “Toray Engineering MI”) has announced that it has developed a semiconductor wafer external appearance system with the industry’s highest inspection speed for high-precision semiconductor wafer inspection. We have developed the inspection device “INSPECTRA(R) SR-IV” and will begin selling it in December 2023.
This equipment responds to the need for higher precision inspections in the semiconductor manufacturing process due to the advancement of semiconductor products for electric vehicles and mobile applications. In high-magnification inspection performed using a 5-20x microscope, the inspection speed is up to twice that of conventional products. We will propose “INSPECTRA(R) SR-IV” to customers who are developing automotive semiconductors, where the need for high-precision and highly efficient semiconductor wafer inspection is particularly increasing. We aim to receive orders of 10 billion yen in fiscal 2028. Currently, there is a growing need for higher performance
semiconductors in order to further improve the functionality of electric vehicles and mobile devices. In order to improve the performance of semiconductors, the miniaturization and multilayering of circuits are progressing, and along with the sophistication of the manufacturing technology of semiconductors themselves, there is a need to perform defect inspection in a takt time that does not reduce the manufacturing efficiency of industrial products. It is being However, in general, when the magnification is increased during inspection, the field of view of the microscope used during inspection becomes narrower, which has the disadvantage of increasing inspection time and reducing efficiency. Furthermore, the narrowing of the field of view worsened optical conditions, making it difficult to obtain clear images and perform detailed inspections.
To address this issue, we have developed a new optical head that can acquire images at twice the imaging cycle compared to conventional models, and have succeeded in shortening the inspection time for high-magnification inspections to about half that of the current level. did. In addition, by developing a function that automatically sets optical conditions that previously had to be adjusted and set manually, we have also reduced the time it takes to set optical conditions.
This device is scheduled to be introduced in a panel exhibition at the “SEMICON Japan” exhibition to be held at Tokyo Big Sight from December 13, 2023.
Toray Engineering MI will contribute to improving the performance and reliability of semiconductors by developing optical and electron beam semiconductor inspection equipment, and will contribute to the realization of a low-carbon society through electrification. Our company leverages technology, engineering techniques, and know-how to provide solutions for all kinds of manufacturing issues.
Details of “INSPECTRA(R) SR-IV” are on the next page.
Record
1. Product name: “INSPECTRA(R) SR-IV”
2. Product features: -High gray with improved inspection performance in addition to the functionality of the conventional model
(INSPECTRA(R) SR-III)

        ・In high magnification inspection, the inspection speed is approximately twice that of our conventional product “INSPECTRA(R) SR-III.”
・Improved device reliability and usability
・Able to share recipes with “INSPECTRA(R) SR-III” (sharing detected defects) 3. Deployment application: 100% inspection of power semiconductor wafers for automotive applications, etc. before shipping
4. Order target: 2.5 billion yen in 2024
FY2028 10 billion yen
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-reference-
About exhibiting at “SEMICON Japan”
1. Exhibition name: SEMICON Japan 2023
2. Location: Tokyo Big Sight
3. Date: December 13th (Wed) – 15th (Fri) 10:00-17:00
4. Booth number: East Hall 5 5308 and East Hall 1 1408
that’s all




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