[AndTech] September 18th (Wednesday) AndTech WEB Online “Soldering for the First Time” Zoom seminar course scheduled to be held *AndTech*
Press release: August 26, 2024
September 18th (Wednesday) AndTech Web Online “First Time Soldering” Zoom Seminar Course Scheduled
*Mr. Shigeto Taniguchi from the Global Manufacturing Department (former General Manager), Electronics Business Headquarters, Sumitomo Wiring Systems, Ltd. will be giving a lecture. *
AndTech Co., Ltd. (Head office: Kawasaki City, Kanagawa Prefecture, Representative Director and President: Masao Suyama, hereinafter As part of the Zoom course for R&D development support, AndTech) is a series of “Soldering for the First Time” by leading instructors, in order to meet the growing need for problem solving in soldering technology.
” course will be held.
In addition to basic knowledge such as the basic principles of soldering, solder equilibrium state diagrams (tin-lead solder), and soldering methods, you can also learn about determining the quality of solder fillets at the mounting site and the effects of poor plating on soldering. Masu. This course is scheduled to start on September 18, 2024.
Details: https://andtech.co.jp/seminars/1eef7be0-65ca-6786-92d2-064fb9a95405
Live streaming/WEB seminar course overview
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Theme: First time soldering
Date and time: Wednesday, September 18, 2024 13:00-17:00
Participation fee: 45,100 yen (tax included) * Materials will be distributed electronically
U R L: https://andtech.co.jp/seminars/1eef7be0-65ca-6786-92d2-064fb9a95405 Web distribution format: Zoom (URL will be sent after application)
Seminar course content structure
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-Program/Lecturer-
Independent (formerly Sumitomo Wiring Systems, Ltd. Electronics Business Division Global Manufacturing Department) Independent (former general manager) Mr. Adult Taniguchi
Knowledge you can learn and technical issues you can solve in this seminar ────────────────────────
1) Basic principles of soldering
2) Solder equilibrium diagram (tin-lead solder)
3) About the soldering method
4) Judging the quality of solder fillets at the mounting site 5) Effects of poor plating on soldering
Format of this seminar
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This will be a live streaming seminar using the web conferencing tool “Zoom”. Details will be provided after you apply.
About AndTech Co., Ltd.
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Chemistry, materials, electronics, automobiles, energy, medical equipment, food packaging, building materials, etc.
We provide research and development support services that provide information for clients involved in R&D in a wide range of fields. We have a team of first-class instructors, and we offer services ranging from “technical courses and seminars” to “lecturer dispatch,” “publishing,” and “consultant dispatch.”
We provide a variety of services such as “market trend research”, “business matching”, and “business development consulting”.
We listen to our clients and provide effective support to help them expand into new business areas and markets of their choice.
https://andtech.co.jp/
AndTech Co., Ltd. List of technical training courses
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We hold a number of web course seminars taught by top-notch
instructors every month.
https://andtech.co.jp/seminars/search
AndTech Co., Ltd. Book list
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We publish books by selecting those with high needs from a wide selection of themes.
https://andtech.co.jp/books
AndTech Co., Ltd. Consulting services
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We will dispatch a highly specialized technical consultant with a wealth of experience.
https://andtech.co.jp/business-consulting
Inquiries regarding this matter
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AndTech Co., Ltd. PR Manager Aoki
Email address: pr●andtech.co.jp (please change ● to @ and contact us)
All program items below (please take a look if you are interested in details) ────────────────────────────
[Purpose of the lecture]
When you hear the word soldering, the first thing that comes to mind is what you learned about it in elementary and junior high school. After understanding the principles of soldering, we will explain the contents of materials, various soldering methods, equilibrium state diagrams, and solder fillet.
Please understand the quality of the shape of the cut, etc. In particular, it can be broadly divided into lead insertion mounting, surface mounting, and manual soldering. We will explain it step by step using videos, so please deepen your understanding.
In addition, lead-free solder is currently used in most of the packaging industry, but until a dozen years ago, lead-containing solder was used. Please understand the difference.
[Program]
1. What is joining?
・About intermetallic compounds
2. Soldering methods (methods) and characteristics
2-1 Flow solder
2-2 Point solder (local flow)
2-3 Reflow soldering
2-4 Hand soldering (manual soldering)
3． What is lead component mounting?
4. Quality of solder fillet shape
5. Defective solder
・Bridge.
・Icicles
・Pinhole (blowhole)
・Void
・Poor wetting
・Unmelted
・Solder ball
・Insufficient flow up
6. Equilibrium diagram (tin-lead solder)
7. What is surface mount?
8. Solder paste (cream solder)
9. Comparison of tin-lead eutectic solder and lead-free solder 10.Frequently Asked Questions
[Q&A]
[Key points of the lecture]
1. Bonding means the formation of intermetallic compounds; if they are not formed, it is not called bonding.
2. The generation of intermetallic compounds means that “diffusion” and “dissolution” occur simultaneously.
3. Soldering requires heat (preheating), flux, and solder.
4. The lead-containing solder used in the past was easy to use, so why was lead banned?
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