Thursday, September 5th AndTech
WEB Online 3-month continuous online learning course “Power Device Introductory Course” Zoom seminar/course with review archive scheduled to be offered
*AndTech*
Press release: August 28, 2024
Thursday, September 5th AndTech
WEB Online 3-month continuous online learning course “Power Device Introductory Course” Zoom seminar/course with review archive scheduled to be offered
*Professional Engineer (General Technical Supervision Department, Electrical and Electronics Department) Mr. Arihiro Kamiya (former Manager of Semiconductor Fundamental Technology Development
Department, DENSO Corporation) will give a lecture. *
AndTech Co., Ltd. (Head office: Kawasaki City, Kanagawa Prefecture, Representative Director and President: Masao Suyama, hereinafter As part of the Zoom course for R&D development support, AndTech) is an introduction to power devices made up of leading instructors in order to meet the problem-solving needs of power devices, whose market is expected to increase in recent years.
” We will be offering a 3-month continuous learning course.
Detailed explanation of materials used in semiconductors and semiconductor devices, types of power devices, and mounting
structures!
The first lecture of this course is scheduled to begin on September 5, 2024. Details: https://andtech.co.jp/seminars/1ef50b58-8aa0-618e-8d0d-064fb9a95405
AndTech Online Live Distribution/WEB Seminar Online Learning Course Overview ────────────────────────────────────
Theme: [3 consecutive months/online learning course] Power device introductory course [live distribution, web seminar, and review archive included]
Date and time: Thursday, September 5, 2024, 13:00-16:00 (2nd lecture: Thursday, October 3rd, 3rd lecture: Thursday, November 7th)
Participation fee: 60,500 yen (tax included) * Materials will be distributed electronically (same price for 2 participants)
U R L: https://andtech.co.jp/seminars/1ef50b58-8aa0-618e-8d0d-064fb9a95405 Web distribution format: Zoom (URL will be sent after application)
Seminar course content structure
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-Program/Lecturer-
Mr. Arihiro Kamiya, Professional Engineer (General Technical Supervision Department, Electrical and Electronics Department) [Part 1] Semiconductors and semiconductor devices
(Date and time: September 5th (Thursday) 13:00-16:00, learning time: 3 hours) [Part 2] Various power devices
(Date and time: October 3rd (Thursday) 13:00-16:00, learning time: 3 hours) [Part 3] Mounting structure of wide bandgap power devices and power modules (Date and time: November 7th (Thursday) 13:00-16:00, learning time: 3 hours)
[Part 1] Semiconductors and semiconductor devices
In the first session, we will explain the basics of semiconductors and materials used in semiconductor devices, as well as diodes and transistors.
[Part 2] Various power devices
In Part 2, we will explain the structures and characteristics of various types of power devices to help you understand them.
[Part 3] Mounting structure of wide bandgap power devices and power modules In Part 3, we will explain the characteristics and structure of wide bandgap devices (WBG), and explain the mounting heat dissipation structure of power modules.
Knowledge you can learn and technical issues you can solve in this seminar ────────────────────────
■Points to note
★Detailed explanation of materials used in semiconductors and semiconductor devices, types of power devices, and mounting
structures!
Format of this seminar
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This will be a live streaming seminar using the web conferencing tool “Zoom”. Details will be provided after you apply.
About AndTech Co., Ltd.
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Chemistry, materials, electronics, automobiles, energy, medical equipment, food packaging, building materials, etc.
We provide research and development support services that provide information for clients involved in R&D in a wide range of fields. We have a team of first-class instructors, and we offer services ranging from “technical courses and seminars” to “lecturer dispatch,” “publishing,” and “consultant dispatch.”
We provide a variety of services such as “market trend research”, “business matching”, and “business development consulting”.
We listen to our clients and provide effective support to help them expand into new business areas and markets of their choice.
https://andtech.co.jp/
AndTech Co., Ltd. List of technical training courses
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We hold a number of web course seminars taught by top-notch
instructors every month.
https://andtech.co.jp/seminars/search
AndTech Co., Ltd. Book list
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We publish books by selecting those with high needs from a wide selection of themes.
https://andtech.co.jp/books
AndTech Co., Ltd. Consulting services
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We will dispatch a highly specialized technical consultant with a wealth of experience.
https://andtech.co.jp/business-consulting
Inquiries regarding this matter
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AndTech Co., Ltd. PR Manager Aoki
Email address: pr●andtech.co.jp (please change ● to @ and contact us)
All program items below (please take a look if you are interested in details) ────────────────────────────
[Part 1] Semiconductors and semiconductor devices
(Date and time: September 5th (Thursday) 13:00-16:00, learning time: 3 hours) 1. Materials used in semiconductor devices
1-1 Materials used in electrical and electronic circuits
1-2 Conductors and insulators
1-3 Change the resistivity
2. Atoms and electrons
2-1 Atoms and electrons
2-2 Electron energy level
2-3 Atomic arrangement and crystals
2-4 Energy levels and energy bands
3.Semiconductor
3-1 Materials that become semiconductors
3-2 Electron movement in the crystal
3-3 Intrinsic/p-type/n-type semiconductors
4.Diode
4-1 PN junction
4-2 Diode operation
4-3 Diode characteristics
5.Transistor
5-1 Types of transistors
5-2 Bipolar transistor
5-3 JFET
5-4 MOSFET
5-5 Semiconductor product name
6. Exercises
[Q&A]
[Part 2] Various power devices
(Date and time: October 3rd (Thursday) 13:00-16:00, learning time: 3 hours) 1.Diode
1-1 High voltage diode
1-2 High-speed switching of diode
2.Bipolar transistor
2-1 Vertical transistor
2-2 High voltage, large current transistor
2-3 Power transistor characteristics
3.MOSFET
3-1 Vertical MOSFET
3-2 Structure and characteristics
3-3 Lower on-resistance
3-4 Comparison of various MOSFETs
4.Thyristor
4-1 Basic structure
4-2 Operation
4-3 Characteristics
5.IGBT
5-1 Structure and operation
5-2 Output characteristics
5-3 IGBT latch-up and countermeasures
5-4 Miniaturization and thinning
5-5 Changes in inverter power loss and miniaturization
5-6 Higher voltage resistance of IGBT
5-7 Reverse conduction IGBT
6. Exercises
[Q&A]
[Part 3] Mounting structure of wide bandgap power devices and power modules (Date and time: November 7th (Thursday) 13:00-16:00, learning time: 3 hours) 1. From Si to wide bandgap devices (WBG)
1-1 Relationship between each device and withstand voltage
1-2 Theoretical limits of voltage resistance for each device 1-3 Comparison of physical properties of wide bandgap semiconductors 1-4 Structure of SiC and GaN
2.SiC device
2-1 PN diode
2-2 SBD
2-3 Effects of SiC SBD
2-4 Structure example to reduce on-resistance
2-5 Structure of SiC MOSFET
2-6 SiC DMOSFET
2-7 SiC MOSFET issues and countermeasure examples
2-8 Electrical characteristics of MOSFET
2-9 SiC wafer yield
2-10 SiC crystal growth method
2-11 Processing of SiC wafer
2-12 Expectations for SiC
2-13 Comparison of power loss (comparison with Si)
3. Development status of GaN devices
3-1 Reasons to expect power elements using GaN devices
3-2 Horizontal and vertical structures of GaN
3-3 Features of GaN HEMT
3-4 Structure example of GaN HEMT
3-5 Issues with vertical GAN
3-6 GaN crystal growth method
3-7 Expectations for GaN power devices
4. Power module and its mounting/heat dissipation structure
4-1 Silicone gel sealing and epoxy resin sealing
4-2 Trend towards higher heat dissipation in power devices
4-3 Modules with various cooling structures
4-4 Relationship between inverter cooling structure and power module 5. Exercises
[Q&A]
*Product and service names mentioned in this news release are trademarks or registered trademarks of each company.
*The information contained in this news release is current as of the date of announcement. It is subject to change without prior notice.
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