[CMC Research] [Live Stream/Zoom] Seminar on “Flexible Substrates and FPC Forming Technology for 5G/6G – LCP-FCCL and its Development” Wednesday, October 15th, Sponsored by: CMC Research, Inc.
CMC Research Press release: September 10, 2025 To Members of the Press [Live Stream/Zoom] Seminar “Flexible Substrates and FPC Forming Technology for 5G/6G – LCP-FCCL and Its Development” to be held! Wednesday, October 15th, Organized by: CMC Research, Inc. ★ Flexible PCBs are essential for everything from smartphones to high-speed communications devices. From the basics of LCP-FCCL to low-dielectric and multilayer FPC formation processes, we’ll thoroughly explain the latest trends from an engineer’s perspective.
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multilayering to examples of new low-dielectric films, this program provides knowledge useful for future FPC substrate design. Tuition ・General: ¥44,000 (tax included) ・Email newsletter membership: ¥39,600 (tax included) ・Academic: ¥26,400 (tax included) ������ Don’t worry if it doesn’t work out! After the live stream, you can watch the Catch-up Streaming (Limited Time Offer). For details and to apply, click here ������ There will also be time for questions and answers. Please join us and apply what you learn in your research and work! 【Knowledge Gained at the Seminar】 ・ Basic Characteristics Required for FPC Substrates ・Why LCP and polyimide film are used in FPCs ・ Key technologies for LCP multilayering ・ Points to note when processing LCP film ・ Example of a method for hybridizing LCP with low-dielectric materials 【Seminar Target Audience】 Development engineers engaged in the development of high-frequency compatible FPCs and their substrates 1) Seminar theme and date and time Theme: Flexible Substrates and FPC Forming Technology for 5G/6G – LCP-FCCL and Its Development – Date and Time: Wednesday, October 15, 2025, 1:30 PM – 4:30 PM Participation Fee: 44,000 yen (tax included) * Includes materials and catch-up streaming. ＊ ¥39,600 (tax included) for newsletter subscribers ＊ Academic price: ¥26,400 (tax included) Instructor: Hiroyuki Ohata FM Tech 〈Seminar Purpose〉 Demand for FPCs using low-dielectric substrates capable of high-frequency
compatibility is increasing, particularly in smartphones. However, the currently used LCP and MPI substrates for high-frequency circuit boards will soon be unable to meet the required dielectric properties. For this reason, efforts are being made to adopt high-frequency FPC materials that are porous or have lower Dk and Df, such as
fluororesin. However, even if these materials have excellent electrical properties, they often lack the fundamental suitability for FPC substrates, making it difficult to form practical FPCs. In this presentation, we will introduce the concept of achieving both low dielectric properties and the basic properties of an FPC substrate, as well as an example of a film developed based on this concept, using crushed LCP microfibers. *This seminar will be live-streamed using the video conferencing tool “Zoom” on the day of the event. Please refer to the tool for recommended environment requirements. The viewing URL will be emailed to you at a later date. ★ Recording and filming during the course are strictly prohibited. ������Catch-up streaming available (for a limited time) ・ If you register for this webinar, we will also provide a “catch-up streaming” service using ZOOM. – With the catch-up streaming service, you can watch the recorded webinar video for a certain period of time. – If you want to review the webinar or can’t attend on the day, you can watch the video as many times as you like within the period. 2) How to apply Please apply through the CMC Research seminar website. We will contact you separately by email with the viewing URL. See the URL for details. Apply
here 3) Introduction to the Seminar Program (There will be a break during the seminar) 1. Instructor Introduction ・Career and development track record (focusing on patent applications) 2. FPC Basics ・ General Structure ・ Required Characteristics of FPC Substrate 3. LCP-FPC ・What is LCP? ・ History of LCP Film/FPC Development ・ LCP-FPC Structure and Process (Material Composition, Multilayer Process) ・ Improving Adhesion Through Surface Treatment (Hydrolysis Prevention, High-Frequency Characteristics) 4. LCP Film/FCCL ・ How to make LCP Film/FCCL (melt extrusion film lamination, solution casting) ・ Issues with LCP Film/FCCL (melt extrusion type: limited heat resistance, composites; solution casting type: water absorption) 5. Why LCP and polyimide are used for FPC substrates ・ The importance of CTE control ・ LCP and PI have something in common ・ CTE control methods (Why can orientation control reduce the CTE to the same level as metal?) – Other issues when using random coil-type resins (thermal shrinkage during heating, entropy elasticity, and energy elasticity) 6. Elemental Technologies for Forming LCP Multilayer FPC ・ Electrode Embedding Method ・ Via/TH Formation ・ Interlayer Adhesion 7. Low Dielectric (Using a Newly Developed LCP Film Manufacturing Method as an Example) ・ Limitations of Low-Dk LCP ・ High-Frequency Compatible Materials Other Than LCP ・ Issues with Other Materials ・What about foam film? ・ Hybridization with low-dielectric materials (composite rules, problems with hybridization using laminates, hybridization using alloy films) ・ Crushed LCP microfibers (difficulty of crushing LCP, how microfibers are formed, characteristics of crushed LCP microfibers) ・Sheeting of crushed LCP microfibers (fiber mat formation method) ・ Orientation control method ・ Low dielectric constant through composites (causes of alignment disturbance and countermeasures) ・Applications of crushed LCP microfibers other than FPC substrates 8. Summary 4) Instructor Introduction Instructor Hiroyuki Ohata, FM Tech [Instructor Background] Since 2000, he has worked at Japan Gore-Tex, and since 2011 at Murata Manufacturing, where he has been developing substrates for high-frequency FPCs (mainly LCP-FCCL and hybrid substrates made of LCP and low-dielectric resin) and developing the elements of the LCP multilayer FPC forming process using these substrates (surface treatment, press material composition, and press conditions). He retired from Murata Manufacturing in December 2021 and is currently working as a technical consultant at “FM Tech,” specializing in high-frequency FPC substrates and FPC formation processes. View Details 5) Information on upcoming webinars (online seminars) ○ Computational science simulation technology at the core of materials informatics September 12, 2025 (Friday) 10:30-16:30 https://cmcre.com/archives/134186/ ○Plastic Recycling in the Zero-Carbon Era Tuesday, September 16, 2025, 1:30 PM – 4:30 PM https://cmcre.com/archives/135304/ *Catch-up streaming available ○ Introduction to AI Drug Discovery in 2 Hours September 17, 2025 (Wednesday) 10:00-12:00 https://cmcre.com/archives/131990/ ○ Fundamentals, Applications, and Development Trends of
Microphysiological Systems (MPS) Thursday, September 18, 2025, 1:30 PM – 4:30 PM https://cmcre.com/archives/132889/ ○Basics, technology trends, and prospects of optical wireless power transfer technology September 19, 2025 (Friday) 10:30-16:30
https://cmcre.com/archives/130998/ ○ Heat dissipation/cooling technology for AI data centers September 24, 2025 (Wednesday) 10:30-16:30 https://cmcre.com/archives/134967/ ○Technology and development trends for FPD glass and semiconductor package glass, as well as glass processing, strength, and strengthening methods Thursday, September 25, 2025, 1:30 PM – 4:30 PM
https://cmcre.com/archives/135357/ ○Crystal Defect Evaluation Technology and Trends for Next-Generation Power Semiconductors and Power Devices Monday, September 29, 2025, 1:30 PM – 4:30 PM
https://cmcre.com/archives/135061/ *Includes missed delivery ○ Fundamentals and mechanisms of corrosion of metallic materials, and key points of corrosion countermeasures and corrosion prevention technologies Wednesday, October 1, 2025, 10:30 AM – 4:30 PM
https://cmcre.com/archives/135908/ *Catch-up streaming available ○Applications of Silica Microparticles and Their Role and Use in Cutting-Edge Fields ~ Silica Microparticles Used in Everyday Products to Cutting-Edge Products ~ October 7, 2025 (Tuesday) 13:30-16:30 https://cmcre.com/archives/135374/ ○ Overview of Rare Metals and Focus Markets – Raw Materials Market for Automotive LIBs, Electrification, Semiconductors, Electronics & Battery Materials, and Aircraft & Light Metal Applications October 9, 2025 (Thursday) 1:30 PM – 4:30 PM https://cmcre.com/archives/133844/ ○ Fundamentals of Slurry
Preparation and Evaluation – From Ceramic Slurries to Battery Electrode Slurries – October 10, 2025 (Friday) 10:30-16:30
https://cmcre.com/archives/135869/ *Catch-up streaming available ○Development of a liver fibrosis treatment method using orally administered nucleic acids Friday, October 10, 2025, 1:30 PM – 4:30 PM https://cmcre.com/archives/135198/ ○Visualize microbial dynamics in real time! New activity and antibacterial evaluation made possible by thermal measurement Tuesday, October 14, 2025, 1:30 PM – 4:30 PM https://cmcre.com/archives/134999/ ○Flexible substrates and FPC forming technologies for 5G/6G – LCP-FCCL and its development – Wednesday, October 15, 2025, 1:30 PM – 4:30 PM
https://cmcre.com/archives/135923/ *Includes missed delivery ○Basic Semiconductor Packaging Technology Course ～ Evolution of packaging formats, manufacturing processes, equipment and materials used, and the latest trends ～ Thursday, October 16, 2025 1:30 PM – 4:30 PM https://cmcre.com/archives/136032/ Click here for a list of upcoming webinars! CMC Research Inc. (Kanda Nishikicho, Chiyoda-ku: https://cmcre.com/) provides cutting-edge technology and market information, holds seminars and publishes books on market and technological trends for various materials and chemicals. 6) Information on related books Click here for a list of published books 以上